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generalplus technology inc. reserves the right to change this documentation without prior notice. information provided by gene ralplus technology inc. is believed to be accurate and reliable. however, generalplus technology inc. makes no warranty for any errors which may appear in this document. contact generalplus technology inc. to obtain the latest version of devi ce specifications before plac ing your order. no responsibility is assumed by generalplus technology inc. for any infringement of patent or other rights of third parties which may result from its use. g g p p r r 2 2 3 3 l l 1 1 2 2 8 8 0 0 0 0 b b 128m-bit mask rom dec. 14, 2009 version 1.1 in addition, generalplus products are not authorized for use as critical components in life s upport devices/systems or aviation devices/systems, where a malfunction or failure of the product may reasonably be expected to result in significant injury to the user, without the expre ss written approval of generalplus.
gpr23l12800b ? generalplus technology inc. proprietary & confidential 2 dec. 14, 2009 version: 1.1 table of contents page 1. features.................................................................................................................................................................................................. 3 2. pin description...................................................................................................................................................................................... 3 2.1. p ad a ssignment .................................................................................................................................................................................. 4 3. mode selection..................................................................................................................................................................................... 5 4. electrical specifications ............................................................................................................................................................... 6 4.1. a bsolute m aximum r atings ............................................................................................................................................................... 6 4.2. dc c haracteristics (t a = 0c ~ 50c, vdd = 2.7v~3.6v) ................................................................................................................ 6 4.3. ac c haracteristics (t a = 0c ~ 50c) .............................................................................................................................................. 6 4.4. ac t est c onditions ............................................................................................................................................................................ 6 4.5. t iming d iagram ................................................................................................................................................................................... 7 4.5.1. random read........................................................................................................................................................................... 7 5. application note.................................................................................................................................................................................. 8 5.1. p ower p ad b onding g uideline .......................................................................................................................................................... 8 5.2. pcb l ayout s uggestion .................................................................................................................................................................... 8 6. package/pad locations ..................................................................................................................................................................... 9 6.1. o rdering i nformation ....................................................................................................................................................................... 9 7. disclaimer............................................................................................................................................................................................. 10 8. revision history ................................................................................................................................................................................. 11
gpr23l12800b ? generalplus technology inc. proprietary & confidential 3 dec. 14, 2009 version: 1.1 128m-bit mask rom 1. features ? bit organization - 16m x 8 (byte mode) - 8m x 16 (word mode) ? fast access time - random access: 85ns @ 3.0v - 3.6v 90ns @ 2.7v - 3.6v ? current - operating: 25ma - standby: 15ua ? temperature - 0 ~ 50 2. pin description symbol pin function a0~a22 address inputs dq0~dq14 data outputs dq15/a-1 d15 (word mode)/ lsb address (byte mode) ceb chip enable input oeb output enable input byteb word/ byte mode selection vdd power supply pin(for internal core) vddq power supply pin(for i/o) vss ground pin(for internal core) vssq ground pin(for i/o) nc no connection
gpr23l12800b ? generalplus technology inc. proprietary & confidential 4 dec. 14, 2009 version: 1.1 2.1. pad assignment 33 vss 29 a0 30 ceb 1 nc 61 nc 60 nc 59 vss 31 nc 32 nc vdd vdd vddq vdd vddq
gpr23l12800b ? generalplus technology inc. proprietary & confidential 5 dec. 14, 2009 version: 1.1 3. mode selection ceb oeb byteb dq15/a-1 dq0~dq7 dq8~dq15 mode power h x x x high z high z - stand-by l h x x high z high z - active l l h output d0~d7 d8~d15 word active l l l input d0~d7 high z byte active
gpr23l12800b ? generalplus technology inc. proprietary & confidential 6 dec. 14, 2009 version: 1.1 4. electrical specifications 4.1. absolute maximum ratings item symbol ratings voltage on any pin relative to vss vin -0.3v to 3.9v ambient operating temperature t opr 0c to 50c storage temperature t stg -65c to 125c 4.2. dc characteristics (t a = 0c ~ 50c, vdd = 2.7v~3.6v) item symbol min. max. conditions output high voltage voh 2.4v - ioh = -400ua output low voltage vol - 0.4v iol = 1.6ma input high voltage vih 0.7xvdd vdd+0.3 input low voltage vil -0.3v 0.8v input leakage current ili - 5ua 0v, vdd output leakage current ilo - 5ua 0v, vdd operating current icc - 25ma f=5mhz, ceb=vil, oeb=vih all output open standby current (cmos) istb - 15ua ceb>vdd-0.2v input capacitance cin - 10pf t a = 25c, f = 1mhz output capacitance cout - 10pf t a = 25c, f = 1mhz 4.3. ac characteristics (t a = 0c ~ 50c) vdd=2.7v~3.6v vdd=3.0v~3.6v item symbol min. min. max. max. read cycle time trc 90ns - 85ns - address access time taa - 90ns - 85ns chip enable access time tce - 90ns - 85ns output enable time toe - 25ns - 25ns output hold after address toh 0ns - 0ns - output high z delay thz - 20ns - 20ns 4.4. ac test conditions input pulse levels 0.4v~ 2.4v input rise and fall times 5ns input timing level 1.5v output timing level 1.5v output load see figure note: no output loading is present in tester load board. active loading is used and under software programming control. output loading capacitance includes load board's and all stray capacitance.
gpr23l12800b ? generalplus technology inc. proprietary & confidential 7 dec. 14, 2009 version: 1.1 4.5. timing diagram 4.5.1. random read note: it will fail to read 1st data from gpr23l12800b after power on if ceb is always set to ground level. please refer the applicat ion note for further details.
gpr23l12800b ? generalplus technology inc. proprietary & confidential 8 dec. 14, 2009 version: 1.1 5. application note 5.1. power pad bonding guideline 1. except nc pads, all the other power pads should be wire bonded, please do not keep them floating. 2. please keep the pcb layout width 20 mil for the vdd/vddq and vss/vssq.(figure 2) 3. for better noise immunity, it is recommended to add bead (300m a minimum) and bypass capacitor near to the vdd/vddq pins. (figure 3) 5.2. pcb layout suggestion 1. the substrate should be float ing, not connected to ground. 2. each power pad (vdd/vddq, vss/vssq) should be wire bonded to a dedicated power pin, then keep one centimeter distance at least before the user want to merge the pcb layout for those pins , can not be just bonded each power pad to the same power pin.(figure 4) 3. the address and data bus lines of mrom should be separated away in pcb layout. 4. each control pin (ceb or oeb) should be shielded by ground lines. 5. if the connector is adopted in the pcb, it is recommended to connect more sets of connections to vss/vssq and vdd/vddq for both the pcb and the system. figure 2. power pin pitch figure 3. bead and bypass capacitor to power pin figure 4. dedicated power pin
gpr23l12800b ? generalplus technology inc. proprietary & confidential 9 dec. 14, 2009 version: 1.1 6. package/pad locations 6.1. ordering information product number package type GPR23L12800B-NNNV-C chip form note1: code number is assigned for customer. note2: code number (n = a - z or 0 - 9, nn = 00 - 99); version (v = a - z).
gpr23l12800b ? generalplus technology inc. proprietary & confidential 10 dec. 14, 2009 version: 1.1 7. disclaimer the information appearing in this public ation is believed to be accurate. integrated circuits sold by generalplus technology are covered by the warranty and patent indem nification provisions stipulated in the terms of sale only. generalplus makes no warranty, express, statutory implied or by description regarding the information in t his publication or regarding the freedom of the described chip(s) from patent infringem ent. furthermore, generalplus makes no warranty of merchantability or fitness for any purpose. generalplus reserves the right to halt production or alter the specifications and prices at any time without notice. acco rdingly, the reader is cautioned to verify that the data sheets and other information in this publication are current before placing orders. products described herein are intended for use in normal co mmercial applications. applications involving unusual environmental or reliability requirements, e.g. military equipment or medical lif e support equipment, are specifically not recommended without additional proc essing by generalplus for such applications. please note th at application circuits illustrated in this document are for reference purposes only.
gpr23l12800b ? generalplus technology inc. proprietary & confidential 11 dec. 14, 2009 version: 1.1 8. revision history date revision # description page dec. 14, 2009 1.1 1. modify 1.features. 2. modify 2.pin description. 3. modify 2.1 pad assignment. 4. modify 4.2 dc characteristics(t a = 0c ~ 50c, vdd = 2.7v~3.6v). 5. modify 4.3 ac characteristics(t a = 0c ~ 50c). 6. add 5. application note. 3 3 4 6 6 8 aug. 16, 2007 1.0 original 8

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